Κατάλογοι Εταιρεία
VERONA WEB
Επωνυμία εταιρείας :
VERONA WEB
Τίτλος Εταιρεία:
Automated Production Equipment (A.P.E.) - Welcome to A.P.E.
Περιγραφή της εταιρείας:
apecorp.com, apecorp, rework, lead free, bga rework, pcb repair, pcb rework, printed circuit board repair, smt rework, bga repair, surface mount rework, ape, rework and repair, automated production equipment, circuit board repair, chipmaster, sniper, bga, smt, circuit boards, desolder, solder, through-hole, pth, ic, pcb, split vision, bandit, intruder, bondmaster, flip chip, csp, chipmaster, sniper ii, sniper i, ape south, automated production equipment, qfp, tsop, plcc, gold plate, gold fingers, desoldering, solder tips, desoldering tips, vacuum extraction, hacko, pace spares, pace cross reference, ex-500, ex-750, 7000-5002, 8100-1000, r1319a, motorola rework, cell phone repair, two-way radio, lcd repair, heat seal bonding, nitrogen injection, bga rework equipment, bga repair equipment, equipo de reparacion, reparacion de circuitos, cbga, ccga, csp, qfn, mlf, pga, 0201, epoxy underfill, ubga, plastic parts, pth, sockets, connector, metal shields, preheating, pre-heating, soak, re-flow, ir, ics, manual, automatic, pcbs, pc, laptop, reballing, re balling, cellular phones, pdas, handhelds, notebooks, motherboards, lan devices, network nodes, military communication equipment, portable medical equipment, usb, xbox 360 reflow, xbox, xbox360, apple laptop reflows, bga reflow, bga rework station, rework station, welcome to ape: if you're interested in repairing printed circuit boards, this site provides in-depth technical documentation and procedures for ape's rework and repair products. it details our split vision, micro bga, csp (chip scale package) and plastic and ceramic bga applications, together with smt, (surface mount technology) and traditional thru-hole desolder technology.
Λέξεις-κλειδιά για την αναζήτηση:
apecorp.com, apecorp, rework, lead free, bga rework, pcb repair, pcb rework, printed circuit board repair, smt rework, bga repair, surface mount rework, ape, rework and repair, automated production equipment, circuit board repair, chipmaster, sniper, bga, smt, circuit boards, desolder, solder, through-hole, pth, ic, pcb, split vision, bandit, intruder, bondmaster, flip chip, csp, chipmaster, sniper ii, sniper i, ape south, automated production equipment, qfp, tsop, plcc, gold plate, gold fingers, desoldering, solder tips, desoldering tips, vacuum extraction, hacko, pace spares, pace cross reference, ex-500, ex-750, 7000-5002, 8100-1000, r1319a, motorola rework, cell phone repair, two-way radio, lcd repair, heat seal bonding, nitrogen injection, bga rework equipment, bga repair equipment, equipo de reparacion, reparacion de circuitos, cbga, ccga, csp, qfn, mlf, pga, 0201, epoxy underfill, ubga, plastic parts, pth, sockets, connector, metal shields, preheating, pre-heating, soak, re-flow, ir, ics, manual, automatic, pcbs, pc, laptop, reballing, re balling, cellular phones, pdas, handhelds, notebooks, motherboards, lan devices, network nodes, military communication equipment, portable medical equipment, usb, xbox 360 reflow, xbox, xbox360, apple laptop reflows, bga reflow, bga rework station, rework station, apecorp.com, apecorp, rework, lead free, bga rework, pcb repair, pcb rework, printed circuit board repair, smt rework, bga repair, surface mount rework, ape, rework and repair, automated production equipment, circuit board repair, chipmaster, sniper, bga, smt, circuit boards, desolder, solder, through-hole, pth, ic, pcb, split vision, bandit, intruder, bondmaster, flip chip, csp, chipmaster, sniper ii, sniper i, ape south, automated production equipment, qfp, tsop, plcc, gold plate, gold fingers, desoldering, solder tips, desoldering tips, vacuum extraction, hacko, pace spares, pace cross reference, ex-500, ex-750, 7000-5002, 8100-1000, r1319a, motorola rework, cell phone repair, two-way radio, lcd repair, heat seal bonding, nitrogen injection, bga rework equipment, bga repair equipment, equipo de reparacion, reparacion de circuitos, cbga, ccga, csp, qfn, mlf, pga, 0201, epoxy underfill, ubga, plastic parts, pth, sockets, connector, metal shields, preheating, pre-heating, soak, re-flow, ir, ics, manual, automatic, pcbs, pc, laptop, reballing, re balling, cellular phones, pdas, handhelds, notebooks, motherboards, lan devices, network nodes, military communication equipment, portable medical equipment, usb, xbox 360 reflow, xbox, xbox360, apple laptop reflows, bga reflow,
Διεύθυνση Εταιρίας :
236 Hamilton Ave,PALO ALTO,CA,USA
Τ.Κ. :
94301-2579
Τηλέφωνο :
6312894735 (+1-631-289-4735)
Αριθμός Φαξ :
6503254321 (+1-650-325-4321)
Ιστοσελίδα :
www. ape. com
Email :
ΗΠΑ SIC κώδικα ( πρότυπη βιομηχανική ταξινόμηση Κώδικα) :
573401
ΗΠΑ SIC Περιγραφή :
Computer Software
Αριθμός Υπαλλήλων:
Πωλήσεις Ποσό :
Ιστορία πιστωτικές:
Υπεύθυνος:
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Εταιρικά Νέα :